Dissemination of IT for the Promotion of Materials Science (DoITPoMS)

System

3 micrographs for system Cu, ordered by micrograph number.


Link to full record for micrograph 142 Micrograph 142 : Tough pitch copper, failed by fibrous ductile fracture.
System: Cu, Composition: Tough pitch copper
Scanning electron microscopy (SEM)
20 μm
Link to full record for micrograph 435 Micrograph 435 : Tough pitch' nearly pure copper, with oxygen impurity
System: Cu, Composition: Cu 99.7 (wt%), some oxygen
Reflected light microscopy
400 μm
Link to full record for micrograph 436 Micrograph 436 : Tough pitch' nearly pure copper, with oxygen impurity
System: Cu, Composition: Cu 99.7 (wt%), some oxygen
Reflected light microscopy
200 μm

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